UniQue HY510 Thermal Heatsink Compound Paste - 25g, ISOL 6 Syringe, Thermal Coupling Of Electrical Devices, Used To Heat Sink Base, Efficient Cooling, Mount Studs Of Transistors, Diodes, And Rectifiers, Environmental Friendly, No Corrosion, No Damage To Unit, Metal-Free And Non-Electrical Conductive, Once Applied Can Last At Least For Years, No Warranty

Product Overview 

The Thermal Grease Zinc Composite Material improves heat transfer by filling microscopic gaps between heat sinks and processors, enhancing cooling efficiency. Made with zinc oxide, it offers excellent thermal conductivity without electrical conductivity, making it safe for CPUs, GPUs, and other sensitive electronics. Its smooth texture ensures easy application and long-lasting performance, ideal for computers, CCTV DVRs, and power amplifiers.

Features

•Excellent heat conductivity for efficient cooling
•Zinc oxide-based composite material for safety
•Non-conductive and non-corrosive formula
•Smooth consistency for easy application
•Long-lasting thermal stability
•Ideal for CPUs, GPUs, LEDs, DVRs, and amplifiers

Specifications

•Product Code: HY510-TU25B
•Description: UniQue Thermal Heatsink Compound Paste
•Material : ISOL 6, Heat Sink Compound.
•Compatibility: CPU and Chipsets Graphics Card LED IC
•Colour : Grey
•Packing Type : Syringe
•Weight : Approx. 25g

UniQue HY510 Thermal Heatsink Compound Paste - ISOL 6 Injection, Thermal Coupling Of Electrical Devices, Used To Heat Sink Base, Mount Studs Of Transistors, Diodes, And Rectifiers, Environmental Friendly, No Corrosion, No Damage To Unit, Metal-Free And Non-Electrical Conductive, Once Applied Can Last At Least For Years, No Warranty

Product Overview 

The UniQue HY510 Thermal Heatsink Compound Paste is a high-performance grey thermal compound weighing approximately 10g, designed for efficient heat transfer between electronic components and heat sinks. It features high thermal conductivity with low thermal resistance, ensuring improved device cooling without electrical conductivity. Resistant to temperature ranges from -50°C to 210°C, it is non-curing, non-corrosive, and bleed-resistant for long-lasting performance.

Features

•Generally used as a thermal coupling of electrical
•Eectronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
•It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical, electronic component, device to the heat sink or chassis,
•There by increasing the overall efficiency of the component Or device
•High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed
•Resistant temp resistant from -50 to 210 C

Specifications

•Product Code: HY510-CN10
•Description: UniQue Thermal Heatsink Compound Paste
•Material : ISOL 6, Heat Sink Compound.
•Compatibility: CPU and Chipsets Graphics Card LED IC
•Colour : Grey
•Packing Type : Injection
•Weight : Approx. 10g